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Canonical URL: https://reuters.com/world/asia-pacific/sk-hynix-holds-groundbreaking-ceremony-4-billion-indiana-ai-chip-packaging-2026-08-27

Current story

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SK Hynix to begin HBM4E production in Indiana in 2029, memory shortage to 2030(reuters.com)
HN #49,487,8222026-08-29 07:44 UTC
2 pointsby giuliomagnifico7 hours ago0 comments

Prior reposts (1 of 2 total)

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SK Hynix holds groundbreaking ceremony for $4B HBM packaging facility at Purdue(reuters.com)
HN #49,466,6042026-08-27 15:38 UTC
3 pointsby alephnerd1 days ago0 comments